General Features

Feature Specifications

  • Xtensa® dual-core 32-bit LX7 microprocessor, up to 240Mhz
  • On-chip 384KB ROM and 512KB SRAM, on-board 8MB PSRAM and 16MB Flash
  • Deep Sleep Mode: 10µA
  • Espressif ESP32-S3 on-chip RF frontend
  • WiFi: IEEE 802.11b/g/n (2.4GHz band); Data Rate: 1M up to 54Mbps (MCS7); Max Tx Power: 20dBm
  • BLE: Bluetooth LE 5.0, Bluetooth mesh; Data Rate: 125kbps to 2Mbps; Max Tx Power: 20dBm
  • Sequans Monarch2 GM02S for CAT-M1, CAT-NB1 and CAT-NB2 support
  • LTE CAT-M1/NB1/NB2 transmit power up to +23dBm
  • PTCRB and GCF 1.3 3GPP release 13 compliant; Operator Approval: Verizon, AT&T, T-Mobile, Vodafone, Orange
  • Semtech SX1262 RF transceiver, 868/915MHz LPWAN Module
  • TX Power: Up to +22dBm; Sensitivity: -127dBm
  • LoRaWAN stack – Class A and Class C Device

Block Diagram

Figure 1: F1 Smart Module Block Diagram