F1 Smart Module

Datasheet — March 2024 V1.1

Download PDF Datasheet

F1 Smart Module

Introduction

The F1 Smart Module is a compact OEM module equipped with BLE, Wi-Fi, LoRa(WAN), and LTE CAT-M1/NB1/NB2 to support various connectivity needs. Running on a MicroPython-programmable microcontroller with a no-barrier entry into the SG Wireless Ctrl. Cloud Platform, the module enables truly limitless IoT application development with multi-network creation flexibility and rapid scaling capacity.

Key Features

  • Multi-connectivity:

    • WiFi 802.11b/g/n (2.4 GHz)

    • Bluetooth BLE 5.0

    • Cellular LTE-CAT M1/NB1/NB2

    • LoRa(WAN) 868 MHz (EU) and 915 MHz (US)

  • Powerful Espressif ESP32-S3 CPU

  • MicroPython programmable with 27 IOs on module pads

  • SMT-friendly semi-hole pins at module edges

  • Operating temperature: −40 °C to 85 °C

  • Compact size: 42.67 mm × 17.73 mm × 3.50 mm

Order Information

Part Number

Description

SGW3501

F1 Smart Module: BLE, WiFi, LoRa, LTE

SGW3401

F1/C Cellular Module: BLE, WiFi and LTE

SGW3201

F1/L LoRa Module: BLE, WiFi and LoRa

General Features

Feature Specifications

Component

Specifications

CPU

Xtensa® dual-core 32-bit LX7 microprocessor, up to 240 MHz
On-chip 384 KB ROM and 512 KB SRAM, on-board 8 MB PSRAM and 16 MB Flash
Deep Sleep Mode: 10 µA

WiFi/BLE

Espressif ESP32-S3 on-chip RF frontend
WiFi: IEEE 802.11b/g/n (2.4 GHz band); Data Rate: 1 M up to 54 Mbps (MCS7); Max Tx Power: 20 dBm
BLE: Bluetooth LE 5.0, Bluetooth mesh; Data Rate: 125 kbps to 2 Mbps; Max Tx Power: 20 dBm

LTE

Sequans Monarch2 GM02S for CAT-M1, CAT-NB1 and CAT-NB2 support
LTE CAT-M1/NB1/NB2 transmit power up to +23 dBm
PTCRB and GCF 1.3 3GPP release 13 compliant; Operator Approval: Verizon, AT&T, T-Mobile, Vodafone, Orange

LoRa(WAN)

Semtech SX1262 RF transceiver, 868/915 MHz LPWAN Module
TX Power: Up to +22 dBm; Sensitivity: −127 dBm
LoRaWAN stack – Class A and Class C Device
F1 Smart Module Block Diagram

Figure 1: F1 Smart Module Block Diagram

Pinout & Pin Definitions

Module Pinout Diagram PDF

F1 Smart Module Pinout Diagram

Figure 1: F1 Smart Module Pinout Diagram

F1 Smart Module Pin-out (Top View)

Figure 2: F1 Smart Module Pin-out (Top View)

Kindly refer to the Mechanical Specifications section for more details on the physical dimensions.

Pin Definitions

Pin Number

Pin Name

MCU Pin

LTE Module Pin

Type

Description

R4

GND

Power

Ground signal

R6

GND

Power

Ground signal

R7

GND

Power

Ground signal

R9

USIM_CLK

SIM0_CLK

Analog I/O

USIM interface I/O to GM02S

R10

USIM_IO

SIM0_IO

Digital I/O

USIM interface I/O to GM02S

R12

GND

Power

Ground signal

R21

GND

Power

Ground signal

R22

RESET

CHIP_PU

Analog I/O

Reset pin to ESP32-S3 for module reset

R23

P0

U0RXD

Analog I/O

UART0 RXD to ESP32-S3

R24

P1

U0TXD

Analog I/O

UART0 TXD to ESP32-S3

R25

P2

GPIO0

Analog I/O or Digital I/O

Analog I/O or Digital I/O to ESP32-S3

R26

P3

GPIO4

Analog I/O or Digital I/O

Analog I/O or Digital I/O to ESP32-S3

R27

P4

MTDO

Digital I/O

Digital I/O to ESP32-S3

R28

P5

GPIO5

Analog I/O or Digital I/O

Analog I/O or Digital I/O to ESP32-S3

*R29

P6

GPIO6

Reserved – Leave floating, do not connect

R30

P7

GPIO3

Analog I/O or Digital I/O

Analog I/O or Digital I/O to ESP32-S3

R31

P8

GPIO46

Digital I/O

Digital I/O to ESP32-S3

R32

P9

GPIO45

Digital I/O

Digital I/O to ESP32-S3

R33

P10

MTCK

Digital I/O

Digital I/O to ESP32-S3

R34

P11

GPIO11

Analog I/O or Digital I/O

Analog I/O or Digital I/O to ESP32-S3

R35

P12

GPIO21

Analog I/O or Digital I/O

Analog I/O or Digital I/O to ESP32-S3

R36

GND

Power

Ground signal

R37

PEXT1

GPIO1

Analog I/O or Digital I/O

Analog I/O or Digital I/O to ESP32-S3

R38

PEXT2

GPIO12

Analog I/O or Digital I/O

Analog I/O or Digital I/O to ESP32-S3

M39

GND

Power

Ground signal

L39

BLE/WIFI_ANT

RF I/O

RF interface to ESP32-S3 for BLE and/or Wi-Fi interface

K39

GND

Power

Ground signal

A38

PEXT3

GPIO14

Analog I/O or Digital I/O

Analog I/O or Digital I/O to ESP32-S3

A37

PEXT4

GPIO13

Analog I/O or Digital I/O

Analog I/O or Digital I/O to ESP32-S3

A36

GND

Power

Ground signal

A35

GND

Power

Ground signal

A34

P13

GPIO20

Analog I/O or Digital I/O

Analog I/O or Digital I/O to ESP32-S3 / USB OTG D+

A33

P14

GPIO19

Analog I/O or Digital I/O

Analog I/O or Digital I/O to ESP32-S3 / USB OTG D−

A32

P15

GPIO38

Digital I/O

Digital I/O to ESP32-S3

A31

P16

GPIO41

Digital I/O

Digital I/O to ESP32-S3

A30

P17

GPIO2

Analog I/O or Digital I/O

Analog I/O or Digital I/O to ESP32-S3

A29

P18

GPIO10

Analog I/O or Digital I/O

Analog I/O or Digital I/O to ESP32-S3

A28

P19

GPIO15

Analog I/O or Digital I/O

Analog I/O or Digital I/O to ESP32-S3

A27

P20

GPIO16

Analog I/O or Digital I/O

Analog I/O or Digital I/O to ESP32-S3

A26

P21

GPIO17

Analog I/O or Digital I/O

Analog I/O or Digital I/O to ESP32-S3

A25

P22

GPIO18

Analog I/O or Digital I/O

Analog I/O or Digital I/O to ESP32-S3

A24

P23

GPIO42

Digital I/O

Digital I/O to ESP32-S3

A23

+3.3V

VDD3P3_CPU VDD3P3_RTC VDD3P3 VDDA

Power

Voltage supply to ESP32-S3 and module main circuit

A22

GND

Power

Ground signal

A21

+1.8V_OUT

VDD_SPI

Power

Voltage supply VDD_SPI to ESP32-S3 for SPI flash and PSRAM

A13

GND

Power

Ground signal

A12

GND

Power

Ground signal

A10

USIM_RST

SIM0_RSTN

Digital I/O

USIM interface I/O to GM02S

A9

USIM_VCC

SIM0_VCC

Power

USIM voltage supply to GM02S

A7

GND

Power

Ground signal

A6

GND

Power

Ground signal

A4

+VBATT

VBAT

Power

Voltage supply to GM02S

E1

GND

Power

Ground signal

F1

LORA_ANT

RF I/O

RF interface to SX1262 for LoRa interface

G1

GND

Power

Ground signal

J1

GND

Power

Ground signal

K1

LTE_ANT

LTE_ANT

RF I/O

RF interface to GM02S for LTE CAT-M1/CAT-NB1/CAT-NB2 interface

L1

GND

Power

Ground signal

Electrical Specifications

Rating & Operating Conditions

Table 1: Absolute Rating and Operating Conditions Specifications

Symbol

Parameter

Min

Typ

Max

Unit

Absolute Rating

+VBATT

Supply voltage to Sequans GM02S LTE module

5.0

5.8

V

+3V3

Supply voltage to Espressif ESP32-S3 and module main circuit

3.0

3.3

3.6

V

+1V8_OUT*

SPI supply voltage (output) of SPI flash and PSRAM for decoupling capacitor connection

1.8

2.3

V

T(OPR)

Operating temperature

−40

85

°C

Operating Conditions

+VBATT

Supply voltage to Sequans GM02S LTE module

2.5

5.0

5.5

V

+3V3

Supply voltage to Espressif ESP32-S3 and module main circuit

3.2

3.3

3.4

V

+1V8_OUT*

SPI supply voltage (output) of SPI flash and PSRAM for decoupling capacitor connection

1.7

1.8

1.9

V

CPU IO (3.3 V power domain, VDD = 3.3 V)

VIH

Input high voltage for GPIOs

0.75 × VDD

VDD + 0.3

V

VIL

Input low voltage for GPIOs

−0.3

0.25 × VDD

V

VOH

Output high voltage for GPIOs

0.8 × VDD

V

VOL

Output low voltage for GPIOs

0.1 × VDD

V

Radio IO (1.8 V power domain)

VIH

Input high voltage for GPIOs

1.26

1.8

V

VIL

Input low voltage for GPIOs

0

0.54

V

VOH

Output high voltage for GPIOs

1.44

1.8

V

VOL

Output low voltage for GPIOs

0

0.36

V

* The +1V8_OUT pin is to connect an external capacitor to the module internal SPI flash and PSRAM for a more robust VDD_SPI supply. This pin should not be connected to any external circuits that may draw more than 20 mA. Voltage of this pin will vary in module light sleep mode and approach zero in module deep sleep mode.

WiFi

Standard: 802.11b/g/n (2.4 GHz ONLY) – 1T1R

Table 2: WiFi Specifications

Parameter

Description

Min

Typ

Max

Unit

General

Freq. (EU)

Operating frequency (EU)

2.402

2.482

GHz

Ch. (EU)

Channel (EU)

1

13

Freq. (US)

Operating frequency (US)

2.402

2.472

GHz

Ch. (US)

Channel (US)

1

11

Power max. (EU/US)

Maximum power (EU/US)

20

dBm

Tx

Tx Power @B – 1 Mbps

Tx power at B mode with data rate 1 Mbps

18

20

dBm

EVM (Peak) @B – 1 Mbps

EVM (Peak) at B mode with data rate 1 Mbps

8

%

Freq. Err. @B – 1 Mbps

Frequency error at B mode with data rate 1 Mbps

−40

0

40

kHz

Tx Power @G – 54 Mbps

Tx power at G mode with data rate 54 Mbps

16

20

dBm

EVM (RMS) @G – 54 Mbps

EVM (RMS) at G mode with data rate 54 Mbps

−25

dB

Freq. Err. @G – 54 Mbps

Frequency error at G mode with data rate 54 Mbps

−40

0

40

kHz

Tx Power @N20 – MCS7

Tx power at N mode with data rate MCS7 and 20 MHz bandwidth

15

20

dBm

EVM (RMS) @N20 – MCS7

EVM rms at N mode with data rate MCS7 and 20 MHz bandwidth

−27

dB

Freq. Err. @N20 – MCS7

Frequency error at N mode with data rate MCS7 and 20 MHz bandwidth

−40

0

40

kHz

Rx

Rx Sens. @B – 1 Mbps

Rx sensitivity at B mode with data rate 1 Mbps

−92.0

−82.0

dBm

Rx Sens. @G – 54 Mbps

Rx sensitivity at G mode with data rate 54 Mbps

−76.5

−66.0

dBm

Rx Sens. @N20 – MCS7

Rx sensitivity at N mode with data rate MCS7 and 20 MHz bandwidth

−71.4

−64.0

dBm

Bluetooth

Standard: BLE 5.0 – 1T1R

Table 3: Bluetooth Specifications

Parameter

Description

Min

Typ

Max

Unit

General

Freq.

Operating frequency

2.4000

2.4835

GHz

Ch.

Channel

0

39

Power max.

Maximum power

20

dBm

Tx

Tx Power @Ch.37 – 1 Mbps

Tx power at channel 37 (freq. = 2402 MHz) with data rate 1 Mbps

17

20

dBm

Freq. Err. @Ch.37 – 1 Mbps

Frequency error at channel 37 (freq. = 2402 MHz) with data rate 1 Mbps

−50

0

50

kHz

Tx Power @Ch.38 – 1 Mbps

Tx power at channel 38 (freq. = 2426 MHz) with data rate 1 Mbps

17

20

dBm

Freq. Err. @Ch.38 – 1 Mbps

Frequency error at channel 38 (freq. = 2426 MHz) with data rate 1 Mbps

−50

0

50

kHz

Tx Power @Ch.39 – 1 Mbps

Tx power at channel 39 (freq. = 2480 MHz) with data rate 1 Mbps

17

20

dBm

Freq. Err. @Ch.39 – 1 Mbps

Frequency error at channel 39 (freq. = 2480 MHz) with data rate 1 Mbps

−50

0

50

kHz

Rx

Rx Sens. @Ch.38 – 2 Mbps

Rx sensitivity at channel 38 (freq. = 2426 MHz) with data rate 2 Mbps

−93.5

dBm

Rx Sens. @Ch.38 – 1 Mbps

Rx sensitivity at channel 38 (freq. = 2426 MHz) with data rate 1 Mbps

−97.5

−70.0

dBm

Rx Sens. @Ch.38 – 500 kbps

Rx sensitivity at channel 38 (freq. = 2426 MHz) with data rate 500 kbps

−100.0

dBm

LTE

Standard: CAT-M1, CAT-NB1, CAT-NB2

Table 4: LTE Frequency Bands (in MHz)

Band

Duplex

Uplink Freq. (MHz)

UL BW (MHz)

Downlink Freq. (MHz)

DL BW (MHz)

LTE-M

NB-IoT

1

FDD

1920 – 1980

60

2110 – 2170

60

Yes

Yes

2

FDD

1850 – 1910

60

1930 – 1990

60

Yes

Yes

3

FDD

1710 – 1785

75

1805 – 1880

75

Yes

Yes

4

FDD

1710 – 1755

45

2110 – 2155

45

Yes

Yes

5

FDD

824 – 849

25

869 – 894

25

Yes

Yes

8

FDD

880 – 915

35

925 – 960

35

Yes

Yes

12

FDD

699 – 716

17

729 – 746

17

Yes

Yes

13

FDD

777 – 787

10

746 – 756

10

Yes

Yes

14

FDD

788 – 798

10

758 – 768

10

Yes

Yes

17

FDD

704 – 716

12

734 – 746

12

No

Yes

18

FDD

815 – 830

15

860 – 875

15

Yes

Yes

19

FDD

830 – 845

15

875 – 890

15

Yes

Yes

20

FDD

832 – 862

30

791 – 821

30

Yes

Yes

25

FDD

1850 – 1915

65

1930 – 1995

65

Yes

Yes

26

FDD

814 – 849

35

859 – 894

35

Yes

Yes

28

FDD

703 – 748

45

758 – 803

45

Yes

Yes

66

FDD

1710 – 1780

70

2110 – 2200

90

Yes

Yes

85

FDD

698 – 716

18

728 – 746

18

Yes

Yes

Table 5: LTE Specifications

Parameter

Description

Min

Typ

Max

Unit

General

Power max.

Maximum power

23

dBm

Tx

Tx Power @Band 8 (900 MHz GSM)

Tx power at Band 8 (900 MHz GSM)

22

23

dBm

Tx Power @Band 2 (1900 MHz PCS)

Tx power at Band 2 (1900 MHz PCS)

22

23

dBm

Rx

Rx sens. @Band 8 (900 MHz GSM)

Rx sensitivity at Band 8 (900 MHz GSM)

−103

−100

dBm

Rx sens. @Band 2 (1900 MHz PCS)

Rx sensitivity at Band 2 (1900 MHz PCS)

−103

−100

dBm

LoRa(WAN)

Mode: LoRa RAW mode and LoRa WAN mode
LoRaWAN Node Type: Class Type A, Class Type C
Frequency Band: EU868, US915

Table 6: LoRa(WAN) Specifications

Parameter

Description

Min

Typ

Max

Unit

General

Freq. (EU)

Frequency band (EU)

863

870

MHz

Freq. (US)

Frequency band (US)

902

928

MHz

Power max. (EU)

Maximum power (EU)

15

dBm

Power max. (US)

Maximum power (US)

22

dBm

Tx

Tx power @866.4 MHz [EU868]

Tx power (Tx tone) at 866.4 MHz

14

15

dBm

Tx power @918.2 MHz [US915]

Tx power (Tx tone) at 918.2 MHz

21

22

dBm

Rx

Rx Sens. @866.4 MHz, BW=500 kHz, SF=12

Rx sensitivity at 866.4 MHz, 500 kHz bandwidth and SF=12

−127

dBm

Module Interface

Power Management

Table 7: Power Consumption by Mode of Operation

Mode of Operation

Min

Typ

Max

Unit

Idle (no radio but MicroPython is running)

30

mA

Light sleep (wake up or restart is required for MicroPython to run)

800

µA

Deep sleep (wake up or restart is required for MicroPython to run)

10

µA

Memory Allocation

Module OS firmware, OTA and user space sizes:

  • Module OS firmware: 2,560 KB

  • OTA1 space: 2,560 KB

  • OTA2 space: 2,560 KB

  • User space: 8 MB

Mechanical Specifications

Module Dimensions

All pins have a pin width of 0.7 mm with the exception of pin VBATT (pin #A4) with a 1.0 mm width.

F1 Smart Module Dimensions

Figure 4: F1 Smart Module Dimensions

MicroPython

Device Programming via UART

  • By default, the F1 Smart Module runs an interactive Python REPL (Read-Eval-Print Loop) on UART0 which is connected to P0 (RX) and P1 (TX) running at 115200 baud.

  • The module can be connected via a development board or any USB UART adapter. Code can be run via the REPL and the SG Wireless Ctrl. Visual Studio Code plug-in can also be used to upload code to the board.

Module-supported Libraries

Table 9: F1 Smart Module Supported Libraries

Library

Description

Python Standard Libraries

array, asyncio, binascii, builtins, cmath, collections, errno, gc, gzip, hashlib, heapq, io, json, math, os, platform, random, re, select, socket, ssl, struct, sys, time, zlib, _thread

MicroPython-specific Libraries

Bluetooth, btree, cryptolib, deflate, framebuf, machine, micropython, neopixel, network, uctypes, esp, esp32

SGW3501 Module-specific Libraries

lte: Ready-to-use LTE CAT-M1/NB1/NB2 library
lora: Ready-to-use LoRa RAW and full stack LoRa WAN device Class A, Class C library
ctrl: Ready-to-use Ctrl Cloud Platform client library

Note

MicroPython documentation library with API function calls: https://docs.micropython.org/. Libraries may vary by version – please check the latest F1 Module firmware release note for the required library (pre-loaded onto Module).

Product Packaging

Modules are packed in tape-and-reel packaging and shipped out in carton boxes.

  • Tape – MSL (Moisture Sensitivity Level): 3

  • Reel – 250 pcs per reel

Note

All units are in millimetres.

Revision History

Version

Released Date

Description

1.0

Feb 7, 2024

Initial document release

2.0

Aug 8, 2024

Add Certification information

Certification

Model

Certification Type

Description

F1

CE Certificate

CE certificate of F1 (Type designation: SGW3501)

F1/C

CE Certificate

CE certificate of F1/C (Type designation: SGW3401)

F1/L

CE Certificate

CE certificate of F1/L (Type designation: SGW3201)

F1

FCC Certificates

FCC certificates of F1 (Type designation: SGW3501)